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近年来,led封装行业一直处于新材料、新工艺的创新驱动和快速发展阶段,新兴封装形式、技术层出不穷,其中最引人注目的是csp(Chip scale package)封装。csp颠
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金(fujian grand Chip investment fund)现向爱思强正式发出了收购要约,愿以每股6欧元、总价6.7亿欧元的价格收购爱思
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能大量推广。倒装技术创新品牌企业广东德力光电有限公司去年推出的异向导电胶封装技术(lep filp Chip)解决了以上瓶颈,并逐步在市场推广开
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昨(22)日,隆达电子宣布将于28日touch taiwan 2019(智慧显示展)中,展出全系列mini led量产产品,包括将覆晶(flip Chip) mini led芯
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a bracket onone end of a semiconductor Chip, the Chip, is the negative side, and th
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