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http://blog.alighting.cn/maneluxcom/archive/2010/12/1/117638.html2010/12/1 14:04:00
一、mb芯片定义与特点定义﹕mb 芯片﹕metal bonding (金属粘着）芯片﹔该芯片属于uec 的专利产品。特点﹕1: 采用高散热系数的材料---si 作为衬底、散热容易。
http://blog.alighting.cn/Antonia/archive/2010/11/18/115018.html2010/11/18 16:06:00
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