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一、mb芯片定义与特点定义﹕mb 芯片﹕metal bonding (金属粘着）芯片﹔该芯片属于uec 的专利产品。特点﹕1: 采用高散热系数的材料---si 作为衬底、散热容易。
http://blog.alighting.cn/Antonia/archive/2010/11/18/115018.html2010/11/18 16:06:00
- chemicals used AS raw materials - military wares and equipments - aviation related products
http://blog.alighting.cn/zktest/archive/2010/11/11/113492.html2010/11/11 17:04:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113490.html2010/11/11 17:03:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113491.html2010/11/11 17:03:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113489.html2010/11/11 17:02:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113488.html2010/11/11 17:01:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113487.html2010/11/11 17:00:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113486.html2010/11/11 16:59:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113484.html2010/11/11 16:58:00
http://blog.alighting.cn/zktest/archive/2010/11/11/113485.html2010/11/11 16:58:00
