站内搜索
https://www.alighting.cn/resource/20051208/128901.htm2005/12/8 0:00:00
https://www.alighting.cn/resource/20051208/128904.htm2005/12/8 0:00:00
https://www.alighting.cn/resource/20051215/128907.htm2005/12/15 0:00:00
https://www.alighting.cn/resource/20051215/128908.htm2005/12/15 0:00:00
https://www.alighting.cn/resource/20051215/128909.htm2005/12/15 0:00:00
https://www.alighting.cn/resource/20051215/128910.htm2005/12/15 0:00:00
目前led封装基板散热设计，大致分成led芯片至封装体的热传导、及封装体至外部的热传达两大部分。使用高热传导材时，封装内部的温差会变小，此时热流不会呈局部性集中，led芯片整体产生
https://www.alighting.cn/resource/20080221/128950.htm2008/2/21 0:00:00
https://www.alighting.cn/news/20070328/85857.htm2007/3/28 0:00:00
https://www.alighting.cn/news/20070328/85858.htm2007/3/28 0:00:00
https://www.alighting.cn/news/20070329/85859.htm2007/3/29 0:00:00
